3M™ 3797 Hot Melt Adhesive: High-Temperature Resistant, Low Viscosity Solution
Ideal for Electrical Encapsulation
The 3M™ 3797 Hot Melt Adhesive is a low-viscosity, high-temperature-resistant adhesive designed for effective coverage and protection in small areas, making it ideal for electrical encapsulation. This 100% solid thermoplastic adhesive provides a 30-second open time, allowing for deep encapsulation tasks. It is recommended for use with the 3M™ Hot Melt Applicator PG II, an excellent tool for high-volume operations.
Key Features and Benefits
- Perfect for Electrical Encapsulation: This adhesive is formulated for applications involving electrical and electronic components. It flows smoothly into tight spaces, such as on printed circuit boards, providing reliable long-term stability and protection.
- High Efficiency in High-Volume Applications: The adhesive is available in PG-sized options for use with the 3M™ PG II Hot Melt Applicator, capable of dispensing up to 7.5 pounds of adhesive per hour. This combination ensures rapid application and increased productivity.
- Fast Set Time: With an approximate 30-second open time, it allows for quick processing and enhanced workflow efficiency.
About Hot Melt Adhesives
Hot melt adhesives, also known as thermoplastic glue sticks, typically have melting points ranging from 250°F to 380°F (121°C to 193°C), depending on the formulation. These adhesives are applied using hot melt applicators, commonly referred to as glue guns. They provide nearly instantaneous bonding for a variety of substrates, including plastics, paper, and wood. While some types soften when reheated, enabling bond separation, their quick-bonding properties make them a go-to solution for packaging and production processes.
3M’s Legacy in Adhesive Science
Since 1925, when a 3M lab assistant invented masking tape, the company has led advancements in adhesive technologies. This commitment to innovation is evident in products like the 3M™ 3797 Hot Melt Adhesive, designed to help businesses improve efficiency, reliability, and overall performance.
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